ECH constructionsite January to August 2015

During the period of January to August 2015 the new test facility was under construction. Starting with the concrete slab that was moulded in January  2015.

2015-01-21 10.17.28-1Pichture of: Urban Bilstrup

The roof was raised in February

2015-02-06 11.18.04Pichture of: Urban Bilstrup

and walls.

2015-02-10 10.19.05Pichture of: Urban Bilstrup

Here comes the steel plates to the chamber

2015-06-08 09.40.05Pichture of: Urban Bilstrup

some tricky manouvering takes place when the packages is moved insied the building.

2015-06-08 09.42.01Pichture of: Urban Bilstrup

3 meter measuring range in place

ECH Elektronikcentrum i Halmstad - 20150713 - joachimbrink - 012Pichture of: Joachim Brink

and sheilded room

ECH Elektronikcentrum i Halmstad - 20150713 - joachimbrink - 025Pichture of: Joachim Brink

and here is the happy team behind ECH test centre.

untitledPichture of: Roland Thörner


embedded conference scandinavia (ECS) 2014

Halmstad University was well represented at ECS 2014, at the action arena two out of three events was arranged by Halmstad University. As well phd students as graduate students was angaged in demos of autonomous quadracopter as dancing neo robots promoting as EIS industrial graduate school as the “master program in computer engineering (civilingenjör i datateknik).


ECH Seminare 7 october: Printed Electronics 101

Neil Chilton  from Printed Electronics Limited U.K. gave the tutorial “Printed Electronics 101 – an overview of inkjet and additive manufacturing methods”. A six hour tutorial which clearly gave me a deeper insight in possibilities and challenges with inkjet printing and additive manufacturing methods for production of electronics. Neils tutorial goes through inkjet printing (material deposition) five basic elemnts: ink(s), inkjet head(s), substrate(s), functionalisation and the platform(machine). The inkjet system’s function is: to deliver the right amount of ink; meassured in carefully dispensed drops,; as accurately as possible; to a substrate that is in motion with resepect to the head; all in a one millimeter journey between the head and the substrate. Clearly this is a challenge!






Raid 2014 (Thursday the 18 of September)

Today Tim Grance from NIST gave the keynote talk ”The Internet of Things and the Four Horsemen of the Apocalypse”, the four horsemen representing: cloud, mobile, social, and big data. If these technologies are the four horsemen of the apocalypse (symbolizing conquest, war, famine, and death, respectively in the book of Revelation in New Testament of the Bible) is maybe questionable. But it is clear that these technologies give very large attack surfaces that will be very hard to handle. Interesting to notice is that Internet of Things (IoT) is an estimated 9 trillion U.S. dollar business which should be contrasted against the wearable market that is estimated to be a 9 billion U.S. dollar market, Tim’s very clear conclusion is that even if the nine billion dollar wearable market is excluded from the overall IoT market, the IoT business would still be 9 trillion U.S. dollar. My conclusion from this talk is that Swedish industry and academia should target to take a large cut from this cake, this an area with a huge potential growth  for Swedish industry. So let’s go for this nine trillion U.S. dollar business!

Visiting RAID 2014 (Wednesday September 17)

Today personnel from ECH are visiting the 17th International Symposium on Research in Attacks, Intrusions, and Defenses (RAID) 2014 in Gothenburg. It is interesting to notice that there exists many common interesting connections  between  electromagnetic compatibility (EMC) and different kinds of attacks against critical infrastructure in  society. One of the first papers presented was “Run away if you can. Persistent Jaming Attacks against Channel Hopping Wi-Fi Devices in Dense Networks” by Il-gu Lee et. al. that is very relevant since jamming also can be refered to as Intentional Electromagnetic Interference (IEMI) and is strongly related to the challenge connected to electromagnetic Interference (EMI) and the Internet of Things (IoT) revolution.

EMC NG a research project within ECH

Background and Motivation

This research project is a strategic effort to increase the knowledge of the next generation of EMC requirements and possibilities in the context of two important and ongoing technology trends: the pervasive computing revolution, also known as Internet of Things (IoT), and new production methods, known as additive manufacturing. There is a need for understanding the new EMC environment and the requirements of electronics and embedded systems, which will follow in the footprints of the pervasive computing revolution. The pervasiveness of embedded systems, smart objects and IoT will be fulfilled by using the next generation of building and production practice. One of the most interesting emerging technologies in this context is additive manufacturing (3D printing) which has the potential to realize extreme integration of electronics and embedded systems.

Research Problem and Approach

The proposed research project is built around the EMC challenge of next generation embedded systems where high end research meets industrial best practice and innovation of new production methods and use of new materials. The focus is to conduct a comprehensive assessment, from an EMC perspective, of using additive manufacturing for integrating embedded electronics. The electromagnetic properties of the materials used in additive manufacturing are to be investigated, examples of important material parameters are: granularity, conductivity, permittivity, and permeability. Different additive production processes may provide varying structure granularity, spatial resolution, and a wide range of materials. However, there is a lack of standardized specifications for mechanical as well as electromagnetic properties enabling a good prediction on how manufactured parts will perform. To increase the opportunities of innovation in the area of additive manufacturing the following research questions have been formulated:

  • How can we provide the necessary knowledge and control of processes, structures, and materials used in additive manufacturing to produce commercially useable devices?
  • What electromagnetic properties do additive manufacturing provide, and does it provide new features usable for further integration of embedded electronics while sustaining EMC performance? What possibilities are there for extreme integration of electronic components, like antennas, for future wireless systems by applying additive manufacturing?


Besides the goal of achieving answers to the research questions, secondary goals of the project are: develop or improve laboratory measurement methods and models that more accurately reflect new requirements related to the pervasive computing vision; and develop best practice and recommendations for implementing these techniques into new EMC test standards. Accelerate the adoption of additive manufacturing and 3D printing technologies in the electronics sector and to increase competitiveness.